Metallization Ceramic Base with Gold Plating for Coil With the properties of high purity alumina ceramic and high frequency anti-high temperature, chemical resistant and non-deformation at any harsh working conditions, metallized ceramic base are widely used in electronic components manufacturing.It can be formed by ceramic injection molding, dry pressing or hot pressing. We offer a selection of types of metallization to meet different needs of different customers, the main metallization type included as following: 1. Raw ceramic body + Molybdenum (Mo/Mn) + nickle (Ni) plating ......................2. Raw ceramic body + Tungsten(W) + gold (Au) plating 3. Raw ceramic body + Molybdenum (Mo/Mn) metallization only..........................4. Raw ceramic body + Silver (Ag) plating only Key Parameters of metallized ceramics Leak Rate ≤1x10-11Pa.m3/s Metal Layer Tensile Strength ≥150Mpa…
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