Enig Immersion Gold PCB

Enig Immersion Gold process has the advantages of high flatness, uniformity, solderability and corrosion resistance, and is widely used in PCB surface treatment process of various electronic products. ENIG is also called Immersion Gold. The chemical nickel content in PCB is generally controlled at 7-9% (medium phosphorus). The chemical nickel phosphorus content is divided into low phosphorus (matt), medium phosphorus (semi gloss) and high phosphorus (bright). The higher the phosphorus content, the stronger the acid corrosion resistance. Chemical nickel is divided into chemical nickel on copper, chemical nickel on copper and chemical nickel palladium processes. Common problems of chemical nickel are “black pad” (often called black disc, the nickel layer is corroded to be gray or black, which is not conducive to solderability) or “mud crack” (fracture). The gold in enig can be divided into thin gold (replacement gold, thickness of 1-5u ″) and thick gold (red…