OSP Antioxidant PCB Circuit Board

Composition of OSP The general ingredients of OSP are: alkyl benzimidazole, organic acid, copper chloride, and deionized water. Advantages of OSP Thermal Stability When compared with FLUXK, which is also a surface treatment agent, it is found that after the secondary heating of OSP at 235°C, the surface has no entanglement phenomenon, and the protective film is not damaged. Take two samples of OSP and FLUXK respectively, and put them into 6NC, 10% constant temperature surface submersible at the same time. After one week, the sample of OSP has no obvious change, while the surface of the sample of FLUXK has small dots, indicating that it is blocked and oxidized after heating. Simple Management The process of OSP is relatively simple and easy to operate. The client can use any kind of welding method to process it without special treatment. In circuit production, there is no need to consider the problem of surface uniformity. There is no need to worry about the concentration of its liq…